JINBORUN had the privilege of participating in the highly anticipated SWOP 2024 – Shanghai World of Packaging Expo, held from November 18-20, 2024, at the Shanghai New International Expo Centre (SNIEC). This year’s event showcased cutting-edge innovations and emerging trends in the packaging industry, providing an excellent platform for networking, knowledge exchange, and discovering new business opportunities.

As a leading company in functional co-extrusion films, we were excited to present our latest solutions and technologies to an engaged audience of industry professionals. The exhibition was a great success, offering valuable insights into the evolving packaging landscape and allowing us to connect with partners, clients, and other key players from around the world.

We were particularly impressed by the diverse range of attendees and the high level of interest in sustainable packaging solutions, automation technologies, and smart packaging innovations. Our team had meaningful conversations with visitors about how these technologies can drive efficiency, sustainability, and innovation in packaging processes.

We look forward to the next edition of the Expo and to continuing to innovate and lead in the packaging industry.

For more information about our products and solutions, please visit our website — JINBORUN New Material Technology Company.

Thank you again for your support, and we look forward to meeting you again at future industry events.

Best regards,  

JINBORUN New Material Technology Company

Phone: +86-13923138887

Tel: +86-19928465582

Email: admin@jinboruncl.com

WhatsApp: +86-13535704058